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Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit

Bougataya, Mohammed and Berriah, Oussama and Lakhssassi, Ahmed and Dahmane, Adel-Omar and Blaquière, Yves and Savaria, Yvon and Norman, Richard and Prytula, Richard. 2010. « Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit ». In IEEE International Conference on Electronics, Circuits, and Systems (ICECS) (Athens, Greece, Dec. 12-15, 2010), pp. 315-318. IEEE Computer Society.
Compte des citations dans Scopus : 1.

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Item Type: Conference proceeding
Professor:
Professor
Blaquière, Yves
Affiliation: Autres
Date Deposited: 21 Feb 2017 14:54
Last Modified: 21 Feb 2017 14:54
URI: http://espace2.etsmtl.ca/id/eprint/14644

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