La vitrine de diffusion des publications et contributions des chercheurs de l'ÉTS
RECHERCHER

Interfacial molecular dynamics of styrenic block copolymer-based nanocomposites with controlled spatial distribution

Helal, E. et Amurin, L. G. et Carastan, D. J. et de Sousa Jr, R. R. et David, E. et Fréchette, M. et Demarquette, N. R.. 2017. « Interfacial molecular dynamics of styrenic block copolymer-based nanocomposites with controlled spatial distribution ». Polymer, vol. 113. p. 9-26.

[img] PDF
Demarquette N. 2017 14661 Interfacial molecular dynamics of styrenic.pdf - Version acceptée
Accès restreint à : Administrateur seulement jusqu'au 9 Février 2019.
Licence d'utilisation : Creative Commons CC BY-NC-ND.

Télécharger (12MB)

Résumé

The dielectric properties of nanocomposites of polystyrene-b-poly (ethylene-co-butylene)-b-polystyrene (SEBS) triblock copolymers containing organically modified clay nanoparticles featuring controlled spatial orientation at the nanoscale: isotropic, totally oriented and partially oriented, have been investigated and correlated with the nanocomposite morphologies. A slow dielectric relaxation process attributed to elastomer chains with reduced mobility confined at nanoparticle/polymer interphase was observed in all the nanocomposites and was found to be dependent on the orientation of nanoclay and polystyrene (PS) domains, the location of clay tactoids as well as the PS block fraction. A dielectric “interfacial” glass transition temperature Tgi assigned to this characteristic relaxation was estimated to occur at temperatures ranging between 6 °C and 35 °C depending on the nanocomposite, which is much higher than the bulk rubber phase glass transition temperature, normally lower than −40 °C for the studied block copolymers. Interestingly, the highest Tgi were associated with the nanocomposites featuring random or partial orientation and/or selective location of nanoparticles in the rubber phase.

Type de document: Article publié dans une revue, révisé par les pairs
Professeur:
Professeur
David, Éric
Demarquette, Nicole R.
Affiliation: Génie mécanique
Date de dépôt: 21 févr. 2017 14:39
Dernière modification: 21 févr. 2017 15:04
URI: http://espace2.etsmtl.ca/id/eprint/14661

Actions (Authentification requise)

Dernière vérification avant le dépôt Dernière vérification avant le dépôt

Statistiques de téléchargement

Plus de statistiques ...