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High temperature creep properties of a linear friction welded newly developed wrought Ni-based superalloy

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Masoumi, F. et Thebaud, L. et Shahriari, D. et Jahazi, M. et Cormier, J. et Devaux, A. et Flipo, B. C. D.. 2018. « High temperature creep properties of a linear friction welded newly developed wrought Ni-based superalloy ». Materials Science and Engineering A, vol. 710. p. 214-226.

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Résumé

AD730™ Ni-based superalloy specimens in solution-treated conditions were linear friction welded. Then, post-weld heat treatment (PWHT), consisting of γ′ sub-solvus solution treatments followed by aging, was conducted on the linear friction welded samples. High temperature creep tests were performed on the as-welded and PWHTed joints at two different temperatures: 700 °C under 600 and 750 MPa stress levels, and 850 °C under 100 and 200 MPa stresses. The creep resistance of the PWHTed joints was higher than that of the as-welded samples. The PWHTed joints exhibited better ductility than that of the base material at 850 °C, while they showed slightly lower creep life at 700 °C in comparison to the base metal. Microstructure examination showed that cracks initiated at the interface of oxidized particles at 700 °C. The decrease in creep resistance of the AD730™ Ni-based superalloy at 850 °C was related to a combination of the formation of precipitate-free zones (PFZ) in the vicinity of the grain boundaries (GBs) and microcracking assisted by oxidation. The Larson-Miller Parameter (LMP) was used to correlate the creep strength, temperature and time to failure for the as-welded and PWHTed samples. LMP values varied between 21.5 × 103 and 24.5 × 103. It was found that in the investigated temperature range, the PWHTed AD730™ has similar creep characteristics as Udimet™720 Li and Inconel 738LC at low values of LMP and better creep properties than those of the Inconel 617 alloy at higher LMP values.

Type de document: Article publié dans une revue, révisé par les pairs
Professeur:
Professeur
Jahazi, Mohammad
Affiliation: Génie mécanique
Date de dépôt: 28 nov. 2017 16:19
Dernière modification: 06 août 2018 18:55
URI: http://espace2.etsmtl.ca/id/eprint/15994

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