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Inverse characterization of adhesive shear modulus in bonded stiffeners using ultrasonic guided waves

Pereira, Daniel et Belanger, Pierre. 2019. « Inverse characterization of adhesive shear modulus in bonded stiffeners using ultrasonic guided waves ». In 45th Annual Review of Progress in Quantitative Nondestructive Evaluation, Volume 38 (Burlington, VT, USA, July 15-19, 2018) Coll. « AIP Conference Proceedings », vol. 2102. USA : AIP Publishing.

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Item Type: Conference proceeding
Professor:
Professor
Bélanger, Pierre
Affiliation: Génie mécanique
Date Deposited: 11 Oct 2019 15:27
Last Modified: 11 Oct 2019 15:27
URI: http://espace2.etsmtl.ca/id/eprint/19559

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