The role of associations in CAD and PLM for handling change propagation during product development

Tremblay, T.G., Rivest, Louis, Msaaf, O. et Maranzana, Roland. 2006. « The role of associations in CAD and PLM for handling change propagation during product development ». In Leading the Web in concurrent engineering : next generation concurrent engineering (Antibes, France, Sept. 18-21, 2006) pp. 507-514. Amsterdam, The Netherlands : IOS Press.
Compte des citations dans Scopus : 5.

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Résumé

Current Computer Aided Design (CAD) systems can capture some of the design intent by creating associations between objects. This increases the productivity during product development, and helps maintain the coherence of the product definition when handling engineering changes. CAD systems establish some associations as well as their use at a rather low level of abstraction, e.g. a parallelism constraint. Product Lifecycle Management (PLM) systems, on the other hand, use associations at a higher abstraction level, generally between files. The associations handled by these systems do differ both in terms of abstraction level and formalism of the knowledge they encapsulate. Moreover, limited connections exist between the associations manipulated in both systems, so that handling change propagation in concurrent engineering remains an issue. In this paper, we propose a taxonomy and a model of the different types of associations required to support the set of tasks in the area of product development. The terms on which the taxonomy relies are: association, relation, link, and constraint. The proposed model, named RLC, uses the concepts of aggregation and decomposition to relate Relations, Links, and Constraints.

Type de document:	Compte rendu de conférence
ISBN:	978-1-58603-651-5
Informations complémentaires:	13th ISPE International Conference on Concurrent Engineering
Professeur:	Professeur Rivest, Louis Maranzana, Roland
Affiliation:	Génie de la production automatisée
Date de dépôt:	31 mars 2014 15:30
Dernière modification:	13 avr. 2023 16:08
URI:	https://espace2.etsmtl.ca/id/eprint/7445

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