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Microstructural evolution during transient liquid phase bonding of Inconel 617 using Ni-Si-B filler metal

Jalilian, F., Jahazi, M. et Drew, R. A. L.. 2006. « Microstructural evolution during transient liquid phase bonding of Inconel 617 using Ni-Si-B filler metal ». Materials Science and Engineering A, vol. 423, nº 1-2. pp. 269-281.
Compte des citations dans Scopus : 51.

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Item Type: Peer reviewed article published in a journal
Professor:
Professor
Jahazi, Mohammad
Affiliation: Autres
Date Deposited: 08 Jun 2015 12:01
Last Modified: 14 Sep 2017 14:14
URI: https://espace2.etsmtl.ca/id/eprint/9666

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