Wadhwa, Arjun, Benavides-Guerrero, Jaime, Gratuze, Mathieu, Bolduc, Martin et Cloutier, Sylvain G..
2024.
« All screen printed and flexible silicon carbide NTC thermistors for temperature sensing applications ».
Materials, vol. 17, nº 11.
Compte des citations dans Scopus : 1.
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Résumé
In this study, Silicon Carbide (SiC) nanoparticle-based serigraphic printing inks were formulated to fabricate highly sensitive and wide temperature range printed thermistors. Inter-digitated electrodes (IDEs) were screen printed onto Kapton® substrate using commercially avaiable silver ink. Thermistor inks with different weight ratios of SiC nanoparticles were printed atop the IDE structures to form fully printed thermistors. The thermistors were tested over a wide temperature range form 25 °C to 170 °C, exhibiting excellent repeatability and stability over 15 h of continuous operation. Optimal device performance was achieved with 30 wt.% SiC-polyimide ink. We report highly sensitive devices with a TCR of −0.556%/°C, a thermal coefficient of 502 K (�-index) and an activation energy of 0.08 eV. Further, the thermistor demonstrates an accuracy of ±1.35 °C, which is well within the range offered by commercially available high sensitivity thermistors. SiC thermistors exhibit a small 6.5% drift due to changes in relative humidity between 10 and 90%RH and a 4.2% drift in baseline resistance after 100 cycles of aggressive bend testing at a 40° angle. The use of commercially available low-cost materials, simplicity of design and fabrication techniques coupled with the chemical inertness of the Kapton® substrate and SiC nanoparticles paves the way to use all-printed SiC thermistors towards a wide range of applications where temperature monitoring is vital for optimal system performance.
| Type de document: | Article publié dans une revue, révisé par les pairs |
|---|---|
| Professeur: | Professeur Cloutier, Sylvain G. |
| Affiliation: | Génie électrique |
| Date de dépôt: | 03 juill. 2024 16:27 |
| Dernière modification: | 08 juill. 2024 18:48 |
| URI: | https://espace2.etsmtl.ca/id/eprint/28897 |
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