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Compatibilization mechanism induced by organoclay in PMMA/PS blends

Genoyer, Julie et Yee, Marcio et Soulestin, Jérémie et Demarquette, Nicole. 2017. « Compatibilization mechanism induced by organoclay in PMMA/PS blends ». Journal of Rheology, vol. 61, nº 4. p. 613-626.

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Résumé

In this work, the effect of adding organoclay (Cloisite 20A) to a poly(methyl metacrylate) (PMMA)/polystyrene (PS) blend was evaluated in order to understand the compatibilization mechanism taking place. The blend morphology was quantified using micrographs obtained by scanning electron microscopy and observed by transmission electron microscopy. The state of dispersion of the clay was studied using small angle X-ray scattering and wide angle X-ray scattering and by applying the Carreau-Yasuda with a yield stress model to small amplitude oscillatory shear (SAOS) data. Morphological analyses revealed that the clay was intercalated, that its addition resulted in a decrease in the size of the dispersed phase and that it was preferentially located at the interface, except in the case of saturated interfaces, in which case the remaining clay was dispersed in PMMA. By applying the simplified Palierne model to SAOS experiments, the interfacial tension between the polymers forming the blend was inferred and shown to decrease upon addition of clay. The relaxation spectra inferred from the SAOS data, using the Honerkamp and Weese method, revealed four relaxation times: Relaxation of PMMA and PS chains, relaxation of the droplet shape, as well as an additional relaxation phenomenon attributed to the Marangoni stress. Although Marangoni stresses have already been studied in the case of blends compatibilized by block copolymers, this is the first time that it has been evidenced in the case of a clay as compatibilizer.

Type de document: Article publié dans une revue, révisé par les pairs
Professeur:
Professeur
Demarquette, Nicole R.
Affiliation: Génie mécanique
Date de dépôt: 05 mai 2017 18:28
Dernière modification: 05 mai 2017 18:37
URI: http://espace2.etsmtl.ca/id/eprint/15248

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