Bougataya, Mohammed, Berriah, Oussama, Lakhssassi, Ahmed, Dahmane, Adel-Omar, Blaquière, Yves, Savaria, Yvon, Norman, Richard et Prytula, Richard.
2010.
« Thermo-mechanical analysis of a reconfigurable wafer-scale integrated circuit ».
In IEEE International Conference on Electronics, Circuits, and Systems (ICECS) (Athens, Greece, Dec. 12-15, 2010)
pp. 315-318.
IEEE Computer Society.
Compte des citations dans Scopus : 1.
Rechercher dans Google Scholar
Official URL: http://dx.doi.org/10.1109/ICECS.2010.5724516
Item Type: | Conference proceeding | ||
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Affiliation: | Autres | ||
Date Deposited: | 21 Feb 2017 14:54 | ||
Last Modified: | 21 Feb 2017 14:54 | ||
URI: | https://espace2.etsmtl.ca/id/eprint/14644 |
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