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Electrical characterization of annular through silicon vias for a reconfigurable wafer-sized circuit board

Diop, Mamadou D., Radji, Moufid, Andre, Walder, Blaquière, Yves, Hamoui, Anas A. et Izquierdo, Ricardo. 2010. « Electrical characterization of annular through silicon vias for a reconfigurable wafer-sized circuit board ». In IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (Austin, TX, USA, Oct. 25-27, 2010) pp. 245-248. IEEE Computer Society.
Compte des citations dans Scopus : 6.

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Item Type: Conference proceeding
Professor:
Professor
Blaquière, Yves
Izquierdo, Ricardo
Affiliation: Autres
Date Deposited: 21 Feb 2017 14:54
Last Modified: 21 Feb 2017 14:54
URI: https://espace2.etsmtl.ca/id/eprint/14645

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