Electrical breakdown properties of clay-based LDPE blends and nanocomposites

Eesaee, Mostafa, David, Eric, Demarquette, Nicole R. et Fabiani, Davide. 2018. « Electrical breakdown properties of clay-based LDPE blends and nanocomposites ». Journal of Nanomaterials, vol. 2018.
Compte des citations dans Scopus : 9.

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Abstract

Microstructure and electrical breakdown properties of blends and nanocomposites based on low-density polyethylene (LDPE) have been discussed. A series of LDPE nanocomposites containing different amount of organomodified montmorillonite (clay) with and without compatibilizer have been prepared by means of melt compounding. Two sets of blends of LDPE with two grades of Styrene-Ethylene-Butylene-Styrene block copolymers have been prepared to form cocontinuous structure and host the nanoreinforcement. A high degree of dispersion of oriented clay was observed through X-ray diffraction, scanning, and transmission electron microscopy. This was confirmed by the solid-like behavior of storage modulus in low frequencies in rheological measurement results. An alteration in the morphology of blends was witnessed upon addition of clay where the transportation phenomenon to the copolymer phase resulted in a downsizing on the domain size of the constituents of the immiscible blends. The AC breakdown strength of nanocomposites significantly increased when clay was incorporated. The partially exfoliated and intercalated clay platelets are believed to distribute the electric stress and prolong the breakdown time by creating a tortuous path for charge carriers. However, the incorporation of clay has been shown to diminish the DC breakdown strength of nanocomposites, mostly due to the thermal instability brought by clay.

Item Type:	Peer reviewed article published in a journal
Uncontrolled Keywords:	Fonds d'auteur ÉTS, FAETS
Professor:	Professor David, Éric Demarquette, Nicole R.
Affiliation:	Génie mécanique, Génie mécanique
Date Deposited:	11 Jan 2018 14:39
Last Modified:	11 Jan 2018 20:36
URI:	https://espace2.etsmtl.ca/id/eprint/16064

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