FRANÇAIS
A showcase of ÉTS researchers’ publications and other contributions
SEARCH

Hard-baked photoresist as a sacrificial layer for sub-180 °C surface micromachining processes

Downloads

Downloads per month over past year

Tawfik, Hani H., Elsayed, Mohannad Y., Nabki, Frederic et El-Gamal, Mourad N.. 2018. « Hard-baked photoresist as a sacrificial layer for sub-180 °C surface micromachining processes ». Micromachines, vol. 9, nº 5.
Compte des citations dans Scopus : 2.

[img]
Preview
PDF
Nabki F 2018 16900.pdf - Published Version
Use licence: Creative Commons CC BY.

Download (4MB) | Preview

Abstract

This letter proposes a method for utilizing a positive photoresist, Shipley 1805, as a sacrificial layer for sub-180 ◦C fabrication process flows. In the proposed process, the sacrificial layer is etched at the end to release the structures using a relatively fast wet-etching technique employing resist remover and a critical point dryer (CPD). This technique allows high etching selectivity over a large number of materials, including silicon-based structural materials such as silicon-carbide, metals such as titanium and aluminum, and cured polymers. This selectivity, as well as the low processing thermal budget, introduces more flexibility in material selection for monolithic integration above complementary metal oxide semiconductor (CMOS) as well as flexible substrates.

Item Type: Peer reviewed article published in a journal
Professor:
Professor
Nabki, Frédéric
Affiliation: Génie électrique
Date Deposited: 16 Jul 2018 21:25
Last Modified: 19 Oct 2020 15:15
URI: https://espace2.etsmtl.ca/id/eprint/16900

Actions (login required)

View Item View Item