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Micro-hole drilling on glass substrates-A review

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Hof, Lucas A. et Ziki, Jana Abou. 2017. « Micro-hole drilling on glass substrates-A review ». Micromachines, vol. 8, nº 2.
Compte des citations dans Scopus : 25.

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Abstract

Glass micromachining is currently becoming essential for the fabrication of micro-devices, including micro- optical-electro-mechanical-systems (MOEMS), miniaturized total analysis systems (µTAS) and microfluidic devices for biosensing. Moreover, glass is radio frequency (RF) transparent, making it an excellent material for sensor and energy transmission devices. Advancements are constantly being made in this field, yet machining smooth through-glass vias (TGVs) with high aspect ratio remains challenging due to poor glass machinability. As TGVs are required for several micro-devices, intensive research is being carried out on numerous glass micromachining technologies. This paper reviews established and emerging technologies for glass micro-hole drilling, describing their principles of operation and characteristics, and their advantages and disadvantages. These technologies are sorted into four machining categories: mechanical, thermal, chemical, and hybrid machining (which combines several machining methods). Achieved features by these methods are summarized in a table and presented in two graphs. We believe that this paper will be a valuable resource for researchers working in the field of glass micromachining as it provides a comprehensive review of the different glass micromachining technologies. It will be a useful guide for advancing these techniques and establishing new hybrid ones, especially since this is the first broad review in this field.

Item Type: Peer reviewed article published in a journal
Professor:
Professor
Hof, Lucas
Affiliation: Autres
Date Deposited: 25 Sep 2018 19:34
Last Modified: 19 Oct 2020 15:23
URI: https://espace2.etsmtl.ca/id/eprint/17334

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