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Ceramic interposers for ultra-high density packaging and 3D circuit integration

Adibi, Arash, Isapour, Aria, Niayesh, Mohsen et Kouki, Ammar. 2018. « Ceramic interposers for ultra-high density packaging and 3D circuit integration ». In IEEE 20th Electronics Packaging Technology Conference (EPTC) (Singapore, Singapore, Dec. 4-7, 2018) pp. 13-16. Piscataway, NJ, USA : IEEE.

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Item Type: Conference proceeding
Professor:
Professor
Kouki, Ammar B.
Affiliation: Génie électrique
Date Deposited: 08 Apr 2019 14:42
Last Modified: 22 Jan 2020 20:00
URI: https://espace2.etsmtl.ca/id/eprint/18519

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