Adibi, Arash, Isapour, Aria, Niayesh, Mohsen et Kouki, Ammar.
2018.
« Ceramic interposers for ultra-high density packaging and 3D circuit integration ».
In IEEE 20th Electronics Packaging Technology Conference (EPTC) (Singapore, Singapore, Dec. 4-7, 2018)
pp. 13-16.
Piscataway, NJ, USA : IEEE.
Rechercher dans Google Scholar
Official URL: http://dx.doi.org/10.1109/EPTC.2018.8654283
| Item Type: | Conference proceeding | ||
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| Affiliation: | Génie électrique | ||
| Date Deposited: | 08 Apr 2019 14:42 | ||
| Last Modified: | 22 Jan 2020 20:00 | ||
| URI: | https://espace2.etsmtl.ca/id/eprint/18519 |
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