Ceramic interposers for ultra-high density packaging and 3D circuit integration

Adibi, Arash, Isapour, Aria, Niayesh, Mohsen and Kouki, Ammar. 2018. « Ceramic interposers for ultra-high density packaging and 3D circuit integration ». In IEEE 20th Electronics Packaging Technology Conference (EPTC) (Singapore, Singapore, Dec. 4-7, 2018) pp. 13-16. Piscataway, NJ, USA : IEEE.
Compte des citations dans Scopus : 2.

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Item Type:	Conference proceeding
Professor:	Professor Kouki, Ammar B.
Affiliation:	Génie électrique
Date Deposited:	08 Apr 2019 14:42
Last Modified:	22 Jan 2020 20:00
URI:	https://espace2.etsmtl.ca/id/eprint/18519

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