Pereira, Daniel et Belanger, Pierre.
2019.
« Inverse characterization of adhesive shear modulus in bonded stiffeners using ultrasonic guided waves ».
In 45th Annual Review of Progress in Quantitative Nondestructive Evaluation, Volume 38 (Burlington, VT, USA, July 15-19, 2018)
Coll. « AIP Conference Proceedings », vol. 2102.
USA : AIP Publishing.
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Official URL: http://dx.doi.org/10.1063/1.5099772
| Item Type: | Conference proceeding |
|---|---|
| ISBN: | 0094-243X |
| Professor: | Professor Bélanger, Pierre |
| Affiliation: | Génie mécanique |
| Date Deposited: | 11 Oct 2019 15:27 |
| Last Modified: | 11 Oct 2019 15:27 |
| URI: | https://espace2.etsmtl.ca/id/eprint/19559 |
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