Inverse characterization of adhesive shear modulus in bonded stiffeners using ultrasonic guided waves

Pereira, Daniel and Belanger, Pierre. 2019. « Inverse characterization of adhesive shear modulus in bonded stiffeners using ultrasonic guided waves ». In 45th Annual Review of Progress in Quantitative Nondestructive Evaluation, Volume 38 (Burlington, VT, USA, July 15-19, 2018) Coll. « AIP Conference Proceedings », vol. 2102. USA : AIP Publishing.
Compte des citations dans Scopus : 3.

The full text of this document is not available here.

Item Type:	Conference proceeding
ISBN:	0094-243X
Professor:	Professor Bélanger, Pierre
Affiliation:	Génie mécanique
Date Deposited:	11 Oct 2019 15:27
Last Modified:	11 Oct 2019 15:27
URI:	https://espace2.etsmtl.ca/id/eprint/19559

Actions (login required)

View Item