Abdelaziz, Mohamed H., Samuel, Agnes M., Doty, Herbert W., Songmene, Victor and Samuel, Fawzy H..
2022.
« Mechanical performance and precipitation behavior in Al-Si-Cu-Mg cast alloys: Effect of prolonged thermal exposure ».
Materials, vol. 15, nº 8.
Compte des citations dans Scopus : 5.
Preview |
PDF
Songmene-V-2022-24420.pdf - Published Version Use licence: Creative Commons CC BY. Download (91MB) | Preview |
Abstract
Al-Si-Cu-Mg cast (354) alloys are used in the automotive sector owing to their remarkable properties which are achievable after applying appropriate thermal treatments. Zirconium, Nickel, and Manganese were added to this category of Al-alloys to preserve good mechanical properties while being exposed to elevated temperatures for long times. The ultimate and yield strength values obtained at room temperature for the stabilized (thermally-exposed) T5-treated condition were comparable to those of the stabilized T6-treated condition, whereas the same properties for T5-treated alloys were higher than those of T6-treated ones for elevated-temperature tensile testing. Interestingly, the results showed that the addition of 0.75 wt.% Mn was competitive with the addition of 2 and 4 wt.% Ni with respect to the elevated-temperature and ambient temperature strength values, respectively. In addition, the Mn-containing alloy M3S exhibited improved ductility values at ambient temperature and at 250 ◦C, compared to the Ni-containing alloys. Examination of the fracture surface of tested samples revealed the advantageous role of sludge particles in enhancing the performance of Mn-containing alloys through their resistance to the propagation of cracks that developed in many intermetallic phases. This finding is considered to be economically significant in view of the lower price of manganese compared to that of nickel.
| Item Type: | Peer reviewed article published in a journal |
|---|---|
| Professor: | Professor Songmene, Victor |
| Affiliation: | Génie mécanique |
| Date Deposited: | 02 Jun 2022 19:09 |
| Last Modified: | 13 Apr 2023 16:08 |
| URI: | https://espace2.etsmtl.ca/id/eprint/24420 |
Actions (login required)
 |
View Item |