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Mechanical performance and precipitation behavior in Al-Si-Cu-Mg cast alloys: Effect of prolonged thermal exposure

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Abdelaziz, Mohamed H., Samuel, Agnes M., Doty, Herbert W., Songmene, Victor et Samuel, Fawzy H.. 2022. « Mechanical performance and precipitation behavior in Al-Si-Cu-Mg cast alloys: Effect of prolonged thermal exposure ». Materials, vol. 15, nº 8.
Compte des citations dans Scopus : 4.

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Résumé

Al-Si-Cu-Mg cast (354) alloys are used in the automotive sector owing to their remarkable properties which are achievable after applying appropriate thermal treatments. Zirconium, Nickel, and Manganese were added to this category of Al-alloys to preserve good mechanical properties while being exposed to elevated temperatures for long times. The ultimate and yield strength values obtained at room temperature for the stabilized (thermally-exposed) T5-treated condition were comparable to those of the stabilized T6-treated condition, whereas the same properties for T5-treated alloys were higher than those of T6-treated ones for elevated-temperature tensile testing. Interestingly, the results showed that the addition of 0.75 wt.% Mn was competitive with the addition of 2 and 4 wt.% Ni with respect to the elevated-temperature and ambient temperature strength values, respectively. In addition, the Mn-containing alloy M3S exhibited improved ductility values at ambient temperature and at 250 ◦C, compared to the Ni-containing alloys. Examination of the fracture surface of tested samples revealed the advantageous role of sludge particles in enhancing the performance of Mn-containing alloys through their resistance to the propagation of cracks that developed in many intermetallic phases. This finding is considered to be economically significant in view of the lower price of manganese compared to that of nickel.

Type de document: Article publié dans une revue, révisé par les pairs
Professeur:
Professeur
Songmene, Victor
Affiliation: Génie mécanique
Date de dépôt: 02 juin 2022 19:09
Dernière modification: 13 avr. 2023 16:08
URI: https://espace2.etsmtl.ca/id/eprint/24420

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