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Characterization of Si and SiO2 in dust emitted during granite polishing as a function of cutting conditions

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Kouam, Jules, Songmene, Victor, Bahloul, Ali et Samuel, Agnes M.. 2022. « Characterization of Si and SiO2 in dust emitted during granite polishing as a function of cutting conditions ». Materials, vol. 15, nº 11.
Compte des citations dans Scopus : 1.

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Résumé

Particles emitted during manufacturing processes such as polishing can represent a serious danger for the environment and for occupational safety. The formation mechanisms responsible for these dust emissions include chip formation, friction at the tool/workpiece and chip/tool interfaces, shearing and cutting. These mechanisms thus depend on workpiece and tool properties, as well as the polishing conditions. In the case of granite polishing, particle emissions during polishing can contain chemical compounds such as silica, which represent harmful health risks for the worker. It is therefore important to characterize the particles emitted and to search for possible interactions between the particles (size and composition) and the machining conditions in order to find ways of reducing emissions at the source. In this study, an investigation was undertaken to characterize the particles emitted during granite polishing as a function of polishing conditions, type of granite, and abrasive grit sizes used. Scanning electron microscopy (SEM) was employed for particle mor- phology characterization and particle grain size and chemical composition were evaluated using X-ray diffraction (XRD) and energy dispersive X-ray (EDX) techniques, respectively. Results show that the influence of polishing speed and feed rate on particle emission depends mainly on the granite type used, providing useful information for controlling the polishing procedure, and thereby dust emission.

Type de document: Article publié dans une revue, révisé par les pairs
Professeur:
Professeur
Songmene, Victor
Affiliation: Génie mécanique
Date de dépôt: 28 juin 2022 21:12
Dernière modification: 13 avr. 2023 16:08
URI: https://espace2.etsmtl.ca/id/eprint/24805

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