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Wafer post-processing for a reconfigurable wafer-scale circuit board

Radji, Moufid, Lakhssassi, Ahmed, Bougataya, Mohammed, Hamoui, Anas A. et Izquierdo, Ricardo. 2009. « Wafer post-processing for a reconfigurable wafer-scale circuit board ». In European Microelectronics and Packaging Conference (EMPC) (Rimini, Italy, June 15-18, 2009) pp. 383-390. IEEE.

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Item Type: Conference proceeding
Professor:
Professor
Izquierdo, Ricardo
Affiliation: Autres
Date Deposited: 19 Sep 2022 19:15
Last Modified: 19 Sep 2022 19:15
URI: https://espace2.etsmtl.ca/id/eprint/25391

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