Wafer post-processing for a reconfigurable wafer-scale circuit board

Radji, Moufid, Lakhssassi, Ahmed, Bougataya, Mohammed, Hamoui, Anas A. and Izquierdo, Ricardo. 2009. « Wafer post-processing for a reconfigurable wafer-scale circuit board ». In European Microelectronics and Packaging Conference (EMPC) (Rimini, Italy, June 15-18, 2009) pp. 383-390. IEEE.
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Item Type:	Conference proceeding
Professor:	Professor Izquierdo, Ricardo
Affiliation:	Autres
Date Deposited:	19 Sep 2022 19:15
Last Modified:	19 Sep 2022 19:15
URI:	https://espace2.etsmtl.ca/id/eprint/25391

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