A reconfigurable power system-in-package module using GaN HEMTs and IC bare dies on LTCC substrate: Design - implementation - experiment and future directions

Nguyen, Van Ha, Aimaier, Nueraimaiti, Nobert, Gabriel, Pham, Tan, Constantin, Nicolas, Blaquiere, Yves and Cowan, Glenn. 2022. « A reconfigurable power system-in-package module using GaN HEMTs and IC bare dies on LTCC substrate: Design - implementation - experiment and future directions ». In 20th IEEE Interregional NEWCAS Conference (IEEE NEWCAS) (Quebec City, QC, Canada, June 19-22, 2022) pp. 188-192. IEEE.
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Official URL: https://doi.org/10.1109/NEWCAS52662.2022.9842234

Item Type:	Conference proceeding
ISBN:	978-1-6654-0105-0
Professor:	Professor Constantin, Nicolas Blaquière, Yves
Affiliation:	Génie électrique, Génie électrique
Date Deposited:	17 Oct 2022 14:03
Last Modified:	17 Oct 2022 14:03
URI:	https://espace2.etsmtl.ca/id/eprint/25645

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