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A reconfigurable power system-in-package module using GaN HEMTs and IC bare dies on LTCC substrate: Design - implementation - experiment and future directions

Nguyen, Van Ha, Aimaier, Nueraimaiti, Nobert, Gabriel, Pham, Tan, Constantin, Nicolas, Blaquiere, Yves et Cowan, Glenn. 2022. « A reconfigurable power system-in-package module using GaN HEMTs and IC bare dies on LTCC substrate: Design - implementation - experiment and future directions ». In 20th IEEE Interregional NEWCAS Conference (IEEE NEWCAS) (Quebec City, QC, Canada, June 19-22, 2022) pp. 188-192. IEEE.

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Item Type: Conference proceeding
ISBN: 978-1-6654-0105-0
Professor:
Professor
Constantin, Nicolas
Blaquière, Yves
Affiliation: Génie électrique, Génie électrique
Date Deposited: 17 Oct 2022 14:03
Last Modified: 17 Oct 2022 14:03
URI: https://espace2.etsmtl.ca/id/eprint/25645

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