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Thermal dynamics effects using pulse-shaping laser sintering of printed silver inks

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Bolduc, M. et Trudeau, C. et Beaupré, P. et Cloutier, S. G. et Galarneau, P.. 2018. « Thermal dynamics effects using pulse-shaping laser sintering of printed silver inks ». Scientific Reports, vol. 8, nº 1. p. 1418.
Compte des citations dans Scopus : 1.

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Cloutier S 2018 16331 Thermal Dynamics Effects using Pulse-Shaping.pdf - Version publiée
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Résumé

In recent years, additive manufacturing has been evolving towards flexible substrates for the fabrication of printable electronic devices and circuits. Generally polymer-based, these emerging substrates suffer from their heat sensitivity and low glass-transition temperatures. As such they require new highly-localized sintering processes to treat the electronic inks without damaging the polymer-based substrate. Laser-based sintering techniques have shown great promises to achieve high-quality sintering locally, while controlling the heat penetration to preserve the polymer substrates integrity. In this report, we explore new optimization pathways for dynamic laser-based sintering of conductive silver inks. Multiple passes of a pulsed laser are first performed while varying pulse train frequencies and pulse energies as an attempt to optimize the properties of the silver inks. Then, time-domain pulse shaping is performed to alter the properties of the conductive inks. Together, these pathways allow for the careful control of the time-domain laser energy distribution in order to achieve the best electronic performances while preserving the substrate’s integrity. Sheet resistance values as low as 0.024Ω/□ are achieved, which is comparable to conventional 1-hour oven annealing, with the processing time dramatically reduced to the milisecond range. These results are supported by finite element modeling of the laser-induced thermal dynamics.

Type de document: Article publié dans une revue, révisé par les pairs
Professeur:
Professeur
Cloutier, Sylvain G.
Affiliation: Génie électrique
Date de dépôt: 12 févr. 2018 17:14
Dernière modification: 27 juin 2018 18:17
URI: http://espace2.etsmtl.ca/id/eprint/16331

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