Bolduc, M., Trudeau, C., Beaupré, P., Cloutier, S. G. et Galarneau, P..
2018.
« Thermal dynamics effects using pulse-shaping laser sintering of printed silver inks ».
Scientific Reports, vol. 8, nº 1.
p. 1418.
Compte des citations dans Scopus : 26.
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Cloutier S 2018 16331 Thermal Dynamics Effects using Pulse-Shaping.pdf - Version publiée Licence d'utilisation : Creative Commons CC BY. Télécharger (1MB) | Prévisualisation |
Résumé
In recent years, additive manufacturing has been evolving towards flexible substrates for the fabrication of printable electronic devices and circuits. Generally polymer-based, these emerging substrates suffer from their heat sensitivity and low glass-transition temperatures. As such they require new highly-localized sintering processes to treat the electronic inks without damaging the polymer-based substrate. Laser-based sintering techniques have shown great promises to achieve high-quality sintering locally, while controlling the heat penetration to preserve the polymer substrates integrity. In this report, we explore new optimization pathways for dynamic laser-based sintering of conductive silver inks. Multiple passes of a pulsed laser are first performed while varying pulse train frequencies and pulse energies as an attempt to optimize the properties of the silver inks. Then, time-domain pulse shaping is performed to alter the properties of the conductive inks. Together, these pathways allow for the careful control of the time-domain laser energy distribution in order to achieve the best electronic performances while preserving the substrate’s integrity. Sheet resistance values as low as 0.024Ω/□ are achieved, which is comparable to conventional 1-hour oven annealing, with the processing time dramatically reduced to the milisecond range. These results are supported by finite element modeling of the laser-induced thermal dynamics.
Type de document: | Article publié dans une revue, révisé par les pairs |
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Professeur: | Professeur Cloutier, Sylvain G. |
Affiliation: | Génie électrique |
Date de dépôt: | 12 févr. 2018 17:14 |
Dernière modification: | 22 janv. 2020 19:45 |
URI: | https://espace2.etsmtl.ca/id/eprint/16331 |
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