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Thin-film encapsulation technology for above-IC MEMS wafer-level packaging

Zhang, Qing, Cicek, Paul-Vahe, Nabki, Frederic et El-Gamal, Mourad. 2013. « Thin-film encapsulation technology for above-IC MEMS wafer-level packaging ». Journal of Micromechanics and Microengineering, vol. 23, nº 12. pp. 125012-125019.
Compte des citations dans Scopus : 3.

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Item Type: Peer reviewed article published in a journal
Professor:
Professor
Nabki, Frédéric
Affiliation: Autres
Date Deposited: 13 Jul 2016 17:38
Last Modified: 13 Jul 2016 17:38
URI: https://espace2.etsmtl.ca/id/eprint/13205

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