Zhang, Qing, Cicek, Paul-Vahe, Nabki, Frederic et El-Gamal, Mourad.
2013.
« Thin-film encapsulation technology for above-IC MEMS wafer-level packaging ».
Journal of Micromechanics and Microengineering, vol. 23, nº 12.
pp. 125012-125019.
Compte des citations dans Scopus : 3.
Rechercher dans Google Scholar
Official URL: http://dx.doi.org/10.1088/0960-1317/23/12/125012
Item Type: | Peer reviewed article published in a journal | ||
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Affiliation: | Autres | ||
Date Deposited: | 13 Jul 2016 17:38 | ||
Last Modified: | 13 Jul 2016 17:38 | ||
URI: | https://espace2.etsmtl.ca/id/eprint/13205 |
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