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MEMS wafer-level vacuum packaging with transverse interconnects for CMOS integration

Lemoine, Dominique, Cicek, Paul-Vahe, Nabki, Frederic et El-Gamal, Mourad N.. 2008. « MEMS wafer-level vacuum packaging with transverse interconnects for CMOS integration ». In IEEE 2008 Custom Integrated Circuits Conference (CICC) (San Jose, CA, USA, Sept. 21-24, 2008) pp. 189-192. Institute of Electrical and Electronics Engineers Inc..
Compte des citations dans Scopus : 6.

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Item Type: Conference proceeding
ISBN: 08865930
Professor:
Professor
Nabki, Frédéric
Affiliation: Autres
Date Deposited: 13 Jul 2016 18:02
Last Modified: 13 Jul 2016 18:02
URI: https://espace2.etsmtl.ca/id/eprint/13229

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