Masoumi, F., Thebaud, L., Shahriari, D., Jahazi, M., Cormier, J., Devaux, A. et Flipo, B. C. D..
2018.
« High temperature creep properties of a linear friction welded newly developed wrought Ni-based superalloy ».
Materials Science and Engineering: A, vol. 710.
pp. 214-226.
Compte des citations dans Scopus : 15.
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Résumé
AD730™ Ni-based superalloy specimens in solution-treated conditions were linear friction welded. Then, post-weld heat treatment (PWHT), consisting of γ′ sub-solvus solution treatments followed by aging, was conducted on the linear friction welded samples. High temperature creep tests were performed on the as-welded and PWHTed joints at two different temperatures: 700 °C under 600 and 750 MPa stress levels, and 850 °C under 100 and 200 MPa stresses. The creep resistance of the PWHTed joints was higher than that of the as-welded samples. The PWHTed joints exhibited better ductility than that of the base material at 850 °C, while they showed slightly lower creep life at 700 °C in comparison to the base metal. Microstructure examination showed that cracks initiated at the interface of oxidized particles at 700 °C. The decrease in creep resistance of the AD730™ Ni-based superalloy at 850 °C was related to a combination of the formation of precipitate-free zones (PFZ) in the vicinity of the grain boundaries (GBs) and microcracking assisted by oxidation. The Larson-Miller Parameter (LMP) was used to correlate the creep strength, temperature and time to failure for the as-welded and PWHTed samples. LMP values varied between 21.5 × 103 and 24.5 × 103. It was found that in the investigated temperature range, the PWHTed AD730™ has similar creep characteristics as Udimet™720 Li and Inconel 738LC at low values of LMP and better creep properties than those of the Inconel 617 alloy at higher LMP values.
Type de document: | Article publié dans une revue, révisé par les pairs |
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Professeur: | Professeur Jahazi, Mohammad |
Affiliation: | Génie mécanique |
Date de dépôt: | 28 nov. 2017 16:19 |
Dernière modification: | 08 sept. 2024 19:17 |
URI: | https://espace2.etsmtl.ca/id/eprint/15994 |
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