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Thermal effects analysis of GaN HEMT power amplifier based on LTCC substrate integration

Jebali, Chokri et Kouki, Ammar. 2018. « Thermal effects analysis of GaN HEMT power amplifier based on LTCC substrate integration ». In 2018 IEEE Canadian Conference on Electrical & Computer Engineering (CCECE) (Québec, QC, Canada, May 13-16, 2018) Piscataway, NJ, USA : IEEE.

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Item Type: Conference proceeding
Professor:
Professor
Kouki, Ammar B.
Affiliation: Génie électrique
Date Deposited: 17 Oct 2018 20:19
Last Modified: 22 Jan 2020 20:00
URI: https://espace2.etsmtl.ca/id/eprint/17446

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