Valentin, Olivier, Viallet, Guilhem, Delnavaz, Aidin, Cretot-Richert, Gabrielle, Ducharme, Mikaël, Monsarat-Chanon, Hami et Voix, Jérémie.
2021.
« Custom-fitted in- and around-the-ear sensors for unobtrusive and on-the-go EEG acquisitions: Development and validation ».
Sensors, vol. 21, nº 9.
Compte des citations dans Scopus : 24.
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Résumé
Objectives: This paper aims to validate the performance and physical design of a wearable, unobtrusive ear-centered electroencephalography (EEG) device, dubbed “EARtrodes”, using early and late auditory evoked responses. Results would also offer a proof-of-concept for the device to be used as a concealed brain–computer interface (BCI). Design: The device is composed of a custom-fitted earpiece and an ergonomic behind-the-ear piece with embedded electrodes made of a soft and flexible combination of silicone rubber and carbon fibers. The location of the conductive silicone electrodes inside the ear canal and the optimal geometry of the behind-the-ear piece were obtained through morphological and geometrical analysis of the human ear canal and the region around-the-ear. An entirely conductive generic earpiece was also developed to assess the potential of a universal, more affordable solution. Results: Early latency results illustrate the conductive silicone electrodes’ capability to record quality EEG signals, comparable to those obtained with traditional gold-plated electrodes. Additionally, late latency results demonstrate EARtrodes’ capacity to reliably detect decision-making processes from the ear. Conclusions: EEG results validate the performance of EARtrodes as a circum-aural and intra-aural EEG recording system adapted for a wide range of applications in audiology, neuroscience, clinical research, and as an unobtrusive BCI.
| Type de document: | Article publié dans une revue, révisé par les pairs |
|---|---|
| Professeur: | Professeur Voix, Jérémie |
| Affiliation: | Génie mécanique |
| Date de dépôt: | 20 mai 2021 20:45 |
| Dernière modification: | 14 juill. 2021 15:03 |
| URI: | https://espace2.etsmtl.ca/id/eprint/22666 |
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