FRANÇAIS
A showcase of ÉTS researchers’ publications and other contributions
SEARCH

Simulation-based inversion for the characterization of adhesively bonded joints using ultrasonic guided waves

Pereira, Daniel, Le Duff, Alain, Painchaud-April, Guillaume et Belanger, Pierre. 2022. « Simulation-based inversion for the characterization of adhesively bonded joints using ultrasonic guided waves ». IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 69, nº 7. pp. 2400-2407.

The full text of this document is not available here.
Rechercher dans Google Scholar
Item Type: Peer reviewed article published in a journal
Professor:
Professor
Bélanger, Pierre
Affiliation: Génie mécanique
Date Deposited: 16 Jun 2022 20:33
Last Modified: 27 Jul 2022 18:56
URI: https://espace2.etsmtl.ca/id/eprint/24521

Actions (login required)

View Item View Item