Pereira, Daniel, Le Duff, Alain, Painchaud-April, Guillaume and Belanger, Pierre.
2022.
« Simulation-based inversion for the characterization of adhesively bonded joints using ultrasonic guided waves ».
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, vol. 69, nº 7.
pp. 2400-2407.
Compte des citations dans Scopus : 7.
Rechercher dans Google Scholar
Official URL: https://doi.org/10.1109/TUFFC.2022.3175773
| Item Type: | Peer reviewed article published in a journal |
|---|---|
| Professor: | Professor Bélanger, Pierre |
| Affiliation: | Génie mécanique |
| Date Deposited: | 16 Jun 2022 20:33 |
| Last Modified: | 27 Jul 2022 18:56 |
| URI: | https://espace2.etsmtl.ca/id/eprint/24521 |
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