Shamsaei, Mohsen, Carter, Alan et Vaillancourt, Michel.
2023.
« Using construction and demolition waste materials to develop chip seals for pavements ».
Infrastructures, vol. 8, nº 5.
Compte des citations dans Scopus : 9.
Prévisualisation |
PDF
Carter-A-2023-26788.pdf - Version publiée Licence d'utilisation : Creative Commons CC BY. Télécharger (5MB) | Prévisualisation |
Résumé
Construction and demolition waste (CDW) materials account for a considerable part of waste materials throughout the world. As these materials are not usually recycled, reusing them in construction projects is of major significance. In this study, recycled concrete, bricks, and glass were used as 100% aggregates of chip seal, which is a corrective or preventive pavement maintenance method. A cationic rapid setting (CRS-2) bitumen emulsion was also used to prepare the chip seal. Different tests, including the sand patch test, sweep test, British pendulum tester (BPT), interface bond, and Vialit test, were conducted. The results of these tests revealed that all these materials had sufficient aggregate embedment for vehicle speeds of more than 70 km/h, and the number of chips was less than 10%, indicating their good performance. All developed chip seals ranked as high skid resistance pavement at ambient temperature. The chip seals developed with concrete and glass showed the best adhesion with an asphalt pavement surface and an aggregate–bitumen adhesion at very cold and ambient temperatures due to the fact of their chemical compositions. Overall, using concrete aggregates to develop chip seals under different traffic loads is recommended. Finally, these findings can provide a novel approach for recycling CDW materials with low costs.
| Type de document: | Article publié dans une revue, révisé par les pairs |
|---|---|
| Professeur: | Professeur Carter, Alan Vaillancourt, Michel |
| Affiliation: | Génie de la construction, Génie de la construction |
| Date de dépôt: | 28 juin 2023 18:49 |
| Dernière modification: | 13 oct. 2023 15:55 |
| URI: | https://espace2.etsmtl.ca/id/eprint/26788 |
Actions (Authentification requise)
 |
Dernière vérification avant le dépôt |