ENGLISH
La vitrine de diffusion des publications et contributions des chercheurs de l'ÉTS
RECHERCHER

Thermo-hydric study of wood-based materials under thermal comfort conditions

Haddouche, Mohamed, Martini, Fahed, Chaouch, Mounir et Ilinca, Adrian. 2024. « Thermo-hydric study of wood-based materials under thermal comfort conditions ». Materials, vol. 17, nº 5.
Compte des citations dans Scopus : 1.

[thumbnail of Ilinca-A-2024-28499.pdf]
Prévisualisation
PDF
Ilinca-A-2024-28499.pdf - Version publiée
Licence d'utilisation : Creative Commons CC BY.

Télécharger (6MB) | Prévisualisation

Résumé

This paper tackles the issue of moisture variation in wood-based materials, explicitly focusing on melamine-coated particleboard (hereafter referred to as melamine) and medium-density fiberboard (MDF) used in the third phase of wood industry transformation. The approach involves a comprehensive strategy for predicting moisture content variation, incorporating numerical simulation, experimental testing, and the application of artificial neural network (ANN) technology to enhance accuracy in furniture manufacturing. The developed ANN models are tailored to predict moisture content changes under specific thermal comfort conditions. Remarkably, these models demonstrate high precision, with an average error margin of only 1.40% for 8% moisture content (MC) and 2.85% for 12% MC in melamine, as well as 1.42% for 8% MC and 2.25% for 12% MC in MDF. These levels of precision surpass traditional models, emphasizing this study’s novelty and practical relevance to the industrial context. The findings indicate that ANN models adapt to diverse environmental conditions, presenting a robust tool for optimizing moisture management in wood-based materials. This research contributes valuable insights for improving the reliability and efficiency of moisture content predictions in the wood industry.

Type de document: Article publié dans une revue, révisé par les pairs
Professeur:
Professeur
Ilinca, Adrian
Affiliation: Génie mécanique
Date de dépôt: 02 avr. 2024 15:50
Dernière modification: 02 avr. 2024 19:32
URI: https://espace2.etsmtl.ca/id/eprint/28499

Actions (Authentification requise)

Dernière vérification avant le dépôt Dernière vérification avant le dépôt