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Design and fabrication of multi-frequency and low-quality-factor capacitive micromachined ultrasonic transducers

Moshrefi, Amirhossein, Ali, Abid, Gratuze, Mathieu et Nabki, Frederic. 2025. « Design and fabrication of multi-frequency and low-quality-factor capacitive micromachined ultrasonic transducers ». Micromachines, vol. 16, nº 7.

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Résumé

Capacitive micromachined ultrasonic transducers (CMUTs) have been developed for air-coupled applications to address key challenges such as noise, prolonged ringing, and side-lobe interference. This study introduces an optimized CMUT design that leverages the squeeze-film damping effect to achieve a low-quality factor, enhancing resolution and temporal precision for imaging as one of the suggested airborne application. The device was fabricated using the PolyMUMPs process, ensuring high structural accuracy and consistency. Finite element analysis (FEA) simulations validated the optimized parameters, demonstrating improved displacement, reduced side-lobe artifacts, and sharper main lobes for superior imaging performance. Experimental validation, including Laser Doppler Vibrometer (LDV) measurements of membrane displacement and mode shapes, along with ring oscillation tests to assess Q-factor and signal decay, confirmed the device’s reliability and consistency across four CMUT arrays. Additionally, this study explores the implementation of multi-frequency CMUT arrays, enhancing imaging versatility across different air-coupled applications. By integrating multiple frequency bands, the proposed CMUTs enable adaptable imaging focus, improving their suitability for diverse diagnostic scenarios. These advancements highlight the potential of the proposed design to deliver a superior performance for airborne applications, paving the way for its integration into advanced diagnostic systems.

Type de document: Article publié dans une revue, révisé par les pairs
Professeur:
Professeur
Nabki, Frédéric
Affiliation: Génie électrique
Date de dépôt: 21 août 2025 14:19
Dernière modification: 23 sept. 2025 21:41
URI: https://espace2.etsmtl.ca/id/eprint/31488

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