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Analysis of temperature evolution along scanning trajectory during laser remelting

Coker, Anirejuoritse, Bordatchev, Evgueni et Tutunea-Fatan, O. Remus. 2025. « Analysis of temperature evolution along scanning trajectory during laser remelting ». In Proceedings of the CSME-CFDSC-CSR 2025 International Congress (Montreal, QC, Canada, May 25-28, 2025) Coll. « Progress in Canadian Mechanical Engineering », vol. 8.

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Résumé

Surface engineering by laser remelting is a niche advanced manufacturing technology that purposely modifies a surface topography without the addition or removal of material Laser remelting occurs through redistribution of molten material along a designated laser path trajectory. This study focuses on the analysis of temperature evolution along a scanning trajectory during surface patterning by laser remelting. For this purpose, several laser remelting experiments were performed while recording live and with high speed the temperature as well as the scanning trajectory in the laser-material interaction zone. Two sample trajectories - square and octagon - were followed with a constant power of 30 W and scanning speeds of 100 mm/s and 300 mm/s. After this, surface topographies were measured to relate surface profile variations to temperature evolution. The preliminary results obtained indicated that the evolution of the temperature distribution predominantly depends on process parameters such as scanning speed, trajectory length, pattern configuration, and laser power. These findings open up new directions in the development of scientific knowledge and engineering solutions geared towards AI-based control and optimization of the laser remelting processes.

Type de document: Compte rendu de conférence
Éditeurs:
Éditeurs
ORCID
Hof, Lucas A.
NON SPÉCIFIÉ
Di Labbio, Giuseppe
NON SPÉCIFIÉ
Tahan, Antoine
NON SPÉCIFIÉ
Sanjosé, Marlène
NON SPÉCIFIÉ
Lalonde, Sébastien
NON SPÉCIFIÉ
Demarquette, Nicole R.
NON SPÉCIFIÉ
Date de dépôt: 18 déc. 2025 15:09
Dernière modification: 18 déc. 2025 15:09
URI: https://espace2.etsmtl.ca/id/eprint/32377

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