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Design and deposition sequence approaches for enhanced residual stress management in directed energy deposition

Saghafi, Marzia, Mohajernia, Bita et Urbanic, Ruth Jill. 2025. « Design and deposition sequence approaches for enhanced residual stress management in directed energy deposition ». In Proceedings of the CSME-CFDSC-CSR 2025 International Congress (Montreal, QC, Canada, May 25-28, 2025) Coll. « Progress in Canadian Mechanical Engineering », vol. 8.

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Résumé

Directed Energy Deposition (DED) Additive Manufacturing (AM) offers significant advantages for fabricating complex geometries and repairing large metal components. However, frequent heating and cooling cycles during the process result in residual stress accumulation, adversely impacting mechanical properties and part reliability. This study investigates strategies to mitigate residual stress through geometric modifications and process optimization, focusing on substrate design, deposition sequences in junctions, and thin-wall structures. An experimentally validated FEM model in SYSWELD was employed to evaluate the effects of incorporating grooves into substrates, optimizing toolpath strategies, and redesigning thin-wall geometries. The results demonstrate that optimized substrate designs, deposition sequences, and geometric configurations for junctions and thin-wall structures effectively reduce residual stress and redirect high-stress regions, enabling enhanced post-processing and improved final part performance. These findings underscore the potential of integrating specialized design and process strategies to improve the reliability and quality of DED-manufactured components.

Type de document: Compte rendu de conférence
Éditeurs:
Éditeurs
ORCID
Hof, Lucas A.
NON SPÉCIFIÉ
Di Labbio, Giuseppe
NON SPÉCIFIÉ
Tahan, Antoine
NON SPÉCIFIÉ
Sanjosé, Marlène
NON SPÉCIFIÉ
Lalonde, Sébastien
NON SPÉCIFIÉ
Demarquette, Nicole R.
NON SPÉCIFIÉ
Date de dépôt: 18 déc. 2025 15:32
Dernière modification: 18 déc. 2025 15:32
URI: https://espace2.etsmtl.ca/id/eprint/32493

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