Fortier, Francois-Xavier, Gerlein, Luis Felipe, Benavides-Guerrero, Jaime, Wadhwa, Arjun, Shah, Krunal, Taherian, Mohamad Hassan, Perrotton, Alexandre, Bolduc, Martin et Cloutier, Sylvain.
2025.
« Improving solder wettability atop screen-printed copper for flexible hybrid electronic circuit assembly ».
Flexible and Printed Electronics.
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Résumé
Poor wettability of solder paste on printed copper (Cu) surfaces presents a significant limitation towards the reliable assembly of flexible hybrid electronic (FHE) circuits. This work addresses this challenge using a low-melting-point, bismuth-based solder on nanoparticle-based copper ink pads serigraphically printed on flexible polyimide. To improve solderability, we introduce a surface treatment involving mechanical polishing of the printed copper with sodium bicarbonate (NaHCO[t]3) to reduce surface porosity and remove organic residues. This treatment enhanced solder wettability by 66%, leading to superior component alignment and assembly quality. The fabricated circuits prove highly robust and withstand a 1000 h accelerated aging test at 85 ∘C and 85% relative humidity. Cross-sectional analysis confirms formation of a m thick intermetallic layer, indicative of an industrial-quality FHE circuit.
| Type de document: | Article publié dans une revue, révisé par les pairs |
|---|---|
| Professeur: | Professeur Cloutier, Sylvain G. |
| Affiliation: | Génie électrique |
| Date de dépôt: | 19 nov. 2025 17:32 |
| Dernière modification: | 19 nov. 2025 20:35 |
| URI: | https://espace2.etsmtl.ca/id/eprint/33003 |
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