Trigui, Mohamed Khaled, Kreitcberg, Alena, Chandoul, Abdelberi, Pelletier, Roger et Demers, Vincent.
2026.
« Effect of sintering temperature and artificial aging on the microstructure and mechanical properties of AlSi10Mg alloy ».
Journal of Manufacturing and Materials Processing, vol. 10, nº 6.
Prévisualisation |
PDF
Kreitcberg-A-2026-34021.pdf - Version publiée Licence d'utilisation : Creative Commons CC BY. Télécharger (12MB) | Prévisualisation |
Résumé
This study investigates the correlation between sintering temperature, microstructure, and mechanical properties in AlSi10Mg alloy produced by supersolidus liquid phase sintering and subsequent artificial aging. Sintering was performed at 571, 575, and 579 °C using different heating rates for a total duration of approximately 5 h, followed by a 2 h dwell at the sintering temperature. At low sintering temperature, the alloy exhibits relatively fine α-Al grains with uniformly distributed Si precipitates, whereas intermediate temperature promotes Si coarsening. At higher temperature, excessive liquid formation leads to coarse α-Al grains and the development of partially interconnected Si networks. β-Al5FeSi progressively coarsen with increasing sintering temperature. In the as-sintered state, the modest mechanical properties result from coarse α-Al grain size and subgrain structure, as well as from the size, morphology, and distribution of the Si phase. After aging (at 160 °C for 6 h following solution treatment at 530 °C for 30 min), the hardness and UTS were almost double (going from 44 ± 1 to 103 ± 2 HV and from 121 ± 1 to 273 ± 40 MPa). Meanwhile, α-Al grain size and Si morphology remained unchanged and Fe-rich intermetallics partially transformed into the more stable γ-Al3FeSi2 phase.
| Type de document: | Article publié dans une revue, révisé par les pairs |
|---|---|
| Chercheur(-euse): | Chercheur(-euse) Kreitcberg, Alena Demers, Vincent |
| Affiliation: | Génie mécanique, Génie mécanique |
| Date de dépôt: | 14 juill. 2026 15:43 |
| Dernière modification: | 26 sept. 2026 16:29 |
| URI: | https://espace2.etsmtl.ca/id/eprint/34021 |
Actions (Authentification requise)
 |
Dernière vérification avant le dépôt |